Federal Bid

Last Updated on 27 Mar 2004 at 5 AM
Solicitation
Location Unknown

59--BONDED SOI WAFERS

Solicitation ID 553-23255-0000-GAX
Posted Date 27 Mar 2003 at 5 AM
Archive Date 27 Mar 2004 at 5 AM
NAICS Category
Product Service Code
Set Aside No Set-Aside Used
Contracting Office Office Of Procurement
Agency National Aeronautics And Space Administration
Location United states
NASA/GSFC has a requirement for the following two items: (1) ADI 4-inch Bonded silicon-on-insulator (SOI) Wafers, double-side polished; quantity: 150; reference attached specification NASA005 (2) ADI 4" SOI Wafer, Double-Side Polished; quantity: 150; reference attached specification NASA006 These wafers are to be used for the development of micro-shutter arrays, which will be used on the James Webb Space Telescope. NASA/GSFC intends to purchase the items from Analog Devices, Belfast Ireland. Analog Devices is the only manufacturer of SOI wafers suitable for the fabrication of microshutter arrays. The Authority is 10 U.S.C. 2304(c)(1), Only One Responsible Source. The Government intends to acquire a commercial item using FAR Part 12 and the Simplified Acquisition Procedures set forth in FAR Part 13. Interested organizations may submit their capabilities and qualifications to perform the effort in writing to the identified point of contact not later than 4:30 p.m. local time on April 11, 2003. Such capabilities/qualifications will be evaluated solely for the purpose of determining whether or not to conduct this procurement on a competitive basis. A determination by the Government not to compete this proposed effort on a full and open competition basis, based upon responses to this notice, is solely within the discretion of the government. Oral communications are not acceptable in response to this notice. All responsible sources may submit an offer which shall be considered by the agency. An Ombudsman has been appointed. See NASA Specific Note "B".
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