NASA/GSFC has a requirement for 200 4 Unibond SOI Wafers with the followingspecifications: Thickness: 0.34um + 1.06um epitaxy= 1.40u BOX thickness: 1.0um Prime QualityNASA/GSFC intends to purchase the items from SOITEC USA.The Government intends to acquire a commercial item using FAR Part 12.Interested organizations may submit their capabilities and qualifications to perform theeffort in writing to Janicea McCree, 301-286-9159 or [email protected], not laterthan 4:30 p.m. local time on June 29, 2009. Such capabilities/qualifications will beevaluated solely for the purpose of determining whether or not to conduct thisprocurement on a competitive basis. A determination by the Government not to competethis proposed effort on a full and open competition basis, based upon responses to thisnotice, is solely within the discretion of the government.Oral communications are not acceptable in response to this notice.All responsible sources may submit an offer which shall be considered by the agency.An Ombudsman has been appointed. See NASA Specific Note "B".Any referenced notes may be viewed at the following URLs linked below.

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