The Department of Defense (DoD) High Performance Computing Modernization Program (HPCMP) is a joint program that serves the Research, Development, Test, and Evaluation (RDT&E) community of the Department of Defense. The HPCMP includes five DoD Supercomputing Resource Centers (DSRC) that provide supercomputing system architecture and deployment expertise, a nation-wide high-performance information-assured data network supporting the DoD RDT&E community and the computational expertise to support DoD scientists and engineers in the development of supercomputing algorithms and applications that solve the problems facing DoD research, acquisition, and operations. The largest of the five Centers is the ERDC DSRC located at the Information Technology Laboratory on the Engineer Research and Development Center campus.
The ERDC DSRC purchased the Cray XC40/50 Supercomputer. The system currently operates at 5.9 pFLOPS. Currently on average, the computational workload in queue is greater than the capability of the machine. In order to ensure the system can handle the increased workload, the processing power needs to be increased by 3.5 pFLOPS. Since this supercomputer is proprietary only Cray, Inc. can provide the additional processing power.

This notice is not a request for competitive quotes or proposals. A solicitation will not be issued. However, interested vendors or contractors may submit their capabilities and qualifications in writing to Olivia White by email address [email protected] no later than the date stated above. Such capabilities/qualifications will be evaluated solely for the purpose of determining whether or not to conduct this procurement on a competitive basis. The determination whether or not to compete this procurement is at the discretion of the Government. All communications in response to this notice must be in writing. Interested parties may submit any information for consideration to [email protected]. All communication must include the reference number in the subject line by the date stated above.

Please see attached J&A.