Sandia National Laboratories offers for commercial licensing a fundamental patent (U.S. Patent No. 6,052,287) in 3D circuit integration based on thru-silicon-via (TSV) technology. The patent describes the use of a silicon interposer to route connections for stacking microchips. Applications may include stacking memory on integrated circuits (ICs), making dense connections to semiconductor devices such as ASICs, FPGAs, focal plane arrays, and MEMS, multi-chip mounting on a single chip carrier, and fan-out of dense contact arrays onto circuit boards. TSV interposers allow stacking circuits for a reduced footprint, a prime benefit for mobile devices. Commercialization paths in this rapidly growing 3DIC market might include manufacturing, sublicensing and/or cross licensing.

Sandia seeks to license technologies for the benefit of the US industry. It is anticipated that commercial licenses may grant rights on a competitive basis to qualified interested parties for appropriate consideration. Licensing options may include grants for defined fields of use, non-exclusive rights, exclusive and sublicensing rights, or assignment. Partnerships to commercialize this technology may also take the form of Cooperative Research and Development Agreements (CRADAs).

Sandia National Laboratories is a multiprogram laboratory managed and operated by Sandia Corporation, a wholly owned subsidiary of Lockheed Martin Corporation, for the U.S. Department of Energy's National Nuclear Security Administration under Contract DE-AC04-94AL85000. SAND# 2011-6047P

For further information, contact Dan Allen at Sandia National Laboratories by email, [email protected], phone 505-284-6752, or fax 505-284-2132.

Keywords: thru silicon via , TSV, 3DIC, Integrated Circuit, IC, Interposer, 3D integration, submount, FPGA, chip stacking, chip packaging, interconnect, multicore mounting, ball grid array, micro ball grid array, BGA, MBGA, chip carrier, MEMS, MEMS integration, flip chip

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