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The University of Oregon, on behalf of Knight Campus for Accelerating Scientific (University), is issuing this RFP for the procurement is interested in purchasing a Deep Reactive Ion Etcher, “BOSCH” style system. The tool will be the etch tool for Silicon substrates and will also serve as our primary plasma etch system. The University also wishes to procure an Plasma Enhanced Chemical Vapor deposition system (PECVD) and/or a Inductively Coupled Plasma Chemical Vapor Deposition system (ICP-CVD) for our plasma based deposition needs. See attached document for details.

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