Federal Bid

Last Updated on 10 Apr 2012 at 8 AM
Sources Sought
Wright patterson air force base Ohio

QTY(300) Silicon Wafers, QTY(88) High-Resistivity Silicon Wafers, and QTY(135) Sapphire Wafers to be used for Microelectronic device fabrication

Solicitation ID FA8601-12-T-0134(SS)
Posted Date 16 Mar 2012 at 5 PM
Archive Date 10 Apr 2012 at 5 AM
NAICS Category
Product Service Code
Set Aside No Set-Aside Used
Contracting Office Not Specified
Agency Department Of Defense
Location Wright patterson air force base Ohio United states 45433
SOURCES SOUGHT SYNOPSIS (Not a Notice of Solicitation)


The United States Air Force, ASC/Operational Contracting Division, Wright-Patterson AFB, Ohio is seeking potential sources that are capable of providing QTY(300) Silicon Wafers, QTY(88) High-Resistivity Silicon Wafers, and QTY(135) Sapphire Wafers to be used for Microelectronic device fabrication. Contractors capable of providing only one or two types of wafers may be considered, as well. Contractors responding should specify that their wafers meet the specifications provided below and provide detailed product information to show clear technical compliance. Additionally, sales history, including recent commercial companies sold to should be included to determine commerciality.

The required specifications for the wafers are as follows:

QTY(300) Silicon wafers which will be used for microelectronic device fabrication
Diameter: SEMI-standard, 3"
Grade: Prime
Orientation: [100] crystal
Dopant: Boron, p-type
Resistivity: 10 to 20 Ohm-cm
Thickness: 381 µm +/- 25 µm
Polish: Single side polished
Flats: SEMI standard

 

QTY(88) High-Resistivity Silicon wafers which will be used for microelectronic device fabrication
Diameter: SEMI-standard, 3"
Si growth method: float zone
Grade: Prime
Orientation: [100] Crystal orientation
Resistivity: >10000 Ohm-cm
Thickness: 381 µm +/- 25 µm
Polish: Single side polished
Flats: SEMI standard
Thermal oxide: 1000 Angstrom thick +/- 5% on both sides


QTY(135) Sapphire wafers which will be used for microelectronic device fabrication
Diameter: SEMI-standard 3"
Orientation: c-plane, crystal
Type: Intrinsic
Thickness: 430 µm - 500 µm
Polish: Double side polished, EPI ready
Flats: SEMI standard
Bow/warp: <10 µm
Ra: <0.3 nm
TTV: <10 µm

All interested contractors shall submit a response demonstrating their capabilities to produce the requested equipment to the Primary Point of Contact listed below. As stipulated in FAR 15.201, responses to this notice are not considered offers and cannot be accepted by the Government to form a binding contract. No solicitation exists; therefore, do not request a copy of the solicitation. The decision to solicit for a contract shall be solely within the Government's discretion.

Contractors responding should indicate whether they are, or are not, a small business, a socially and economically disadvantaged business, or a woman owned business. The general definition of a small business is one that is independently owned and operated, is not dominant in the field of operation in which it is proposing on Air Force contracts and with its affiliates; and the number of employees does not exceed 500. NAICS Code to be used for this acquisition is 334413. The Government reserves the right to consider a small business set-aside based upon responses hereto for any subsequent acquisition. Respondents are further requested to indicate their status as a Foreign-owned/Foreign-controlled contractor and any contemplated use of foreign national employees on this effort.

Any information submitted by respondents to this sources sought synopsis is voluntary. This sources sought notice is not to be construed as a commitment by the Government, nor will the Government reimburse any costs associated with the submission of information in response to this notice. Respondents will not individually be notified of the results of any government assessments. The Government's evaluation of the capability statements received will factor into whether any forthcoming solicitation will be conducted as a full and open competition or as a set-aside for small businesses, or any particular small business designation (e.g. SDVOSB, HUBZone, 8(a), SDB, WOSB, VOSB, etc.).

CAPABILITIES PACKAGE: All interested contractors shall submit a capabilities package that explicitly demonstrates company capabilities-indicating examples of commercial sales-and product specifications related to this effort. Responses may be submitted electronically to the following e-mail address: [email protected] in a Microsoft Word compatible format or mailed to ASC/PKOAA POC: Chad Hines, 1940 Allbrook Dr. Ste 3 Rm 109, Wright-Patterson AFB, OH 45433-5309 to be received no later than Noon Eastern Standard Time, Monday 26 March 2012. Direct all questions concerning this acquisition to Chad Hines at [email protected].

 

 

Bid Protests Not Available

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