NASA/NSSC has a requirement for Silicon on Insulator (SOI) wafers.  The wafers we
require is the thickness uniformity and high resistivity of the device layer.  They require a thickness uniformity of +/- 25nm, 3-sigma, with 5 mm edge exclusion.  Variability in the thickness causes unacceptable variation in the performance of detectors in large arrays and in most cases causes failure in the fabrication process during the final steps.

NASA/NSSC intends to purchase the Silicon on Insulator (SOI) wafers, from SEH America, Inc.,located at 4111 NE 112th Ave., Vancouver, Washington, 98682-6776, 
under the authority of FAR 13.106-1(b)(1)(i).  It has been determined that SEH America, as the only vendor which can meet the required thickness uniformity specification.

NASA/NSSC will be the procuring center for this effort.  Performance will be located in
Greenbelt, Maryland.

The Government intends to acquire commercial items and services using the provision, clauses and procedures prescribe in FAR Part 12 and FAR Part 13.

The NAICS Code for this procurement is 334413

Interested organization may submit their capabilities and qualification to perform the 
effort in writing to the identified point of contact not later than March 20, 2017.  Such
capabilities/qualification will be evaluated solely for purpose of determing whether or ot to conduct this procurement on a competitive basis.  A determination by the Goverment not to compete this proposed effort on a full and open competition basis, based upon responses to this notice, is soley with the discretion of the government.

Oral communication are not acceptable in response to this notice.

NASA Clause 1852.215-84, Ombudsman, is applicable.  The Center Ombudsman for this acquisition can be found at http://prod.nais.nasa.gov/pub_library/Omb.html. 





 

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