SLAC National Accelerator Laboratory is issuing this sources sought synopsis as a means of conducting market research to identify parties having an interest in and the resources to support these requirement.

Supplier will work with SLAC to ensure that the sensor design is optimized and compatible with the vendor's fabrication process.

Supplier will have two sets of photomasks manufactured incorporating the SLAC sensor designs.  Supplier will fully process a batch of 20 silicon wafers to form the devices described by SLAC design.

The wafers will be float-zone silicon with substrate resistivity of at least 6,000 Ohm-cm and have a net doping so as to be n-type. Wafers will be 500 micrometers thick and 150 millimeters in diameter with a (100) crystal orientation.   The wafers will be processed and patterned on both major surfaces as described by the design. After the wafers have been manufactured the vendor will test them. Required performance specifications are reverse-bias breakdown voltages exceeding 300 Volts and active area sensor dark leakage currents below 2 nanoaperes per square centimeter when reversed biased so as to be over-depleted by 5 volts.

Qty-1 of  Description: 20 x 150mm pixel sensor wafers
Qty-1 of Wafer processing
Qty-1 of Layour adaptation
Qty-1 of Proto mask tooling