The purpose of amendment 0002 is to extend the NLT response date

FROM:  August 19, 2016

TO:  August 29, 2016, 12:00pm EST;

AND to provide the following questions and responses:

Q1. Specify the substrate shape and size requirement that will be used for acceptance or system usage
R1. This is not being used to coat wafers. Chamber size is specified in specification number 1 "Shall have a minimum work chamber size of 125 mm diameter by 100 mm height"

Q2. What is the required sputter target size/gun size?
R2. Disk style: minimum of 55 mm diameter and 0.1 mm thickness

Q3. Is there a requirement for the type of sputter gun required, DC or RF?
R3. No

Q4. Are gases other than Argon gas required to be processed?
R4. Capability for Argon process gas and Nitrogen venting gas is required

Q5. Is a heater for the substrate required?
R5. No

Q6. Is there a vacuum requirement such as minimum base pressure etc..?
R6. A clean (oil free) vacuum pumping system capable of pumping down to at least 10^-4 Torr, is required, as indicated in Amendment 0001

Q7. Does "rotational tilting" mean primary/polar rotation and azimuthal rotation (i.e the center of the substrate is fixed during rotation); OR the rotation and tilting will be used independent of each other where the center of the substrate is not fixed.
R7. Where the sample is rotated about the vertical and can also be tilted independently from horizontal.

Q8. Clarify the number of sputter guns required in the chamber. The solicitation stated a dual sputter technique. If two sputter guns are required, will users share one DC or RF (specify whether DC or RF is required) supply or need two independent power supply.
R8. Two sputter guns are required for sequential sputtering. Therefore, both can share the same power source. There is not a requirement for DC or RF

Q9. Specify gold target and chromium target diameter and thickness listed in specification number 9.
R9. Minimum of 55 mm diameter and 0.1 mm thickness

All other terms and conditions remain unchanged