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Microsystems packaging requires the assembly and interconnections of microelectronics, MEMS, photonics, RF/wireless, fluids and other microscale devices onto a system-level board or chip to form an integrated microsystems product. Because the microsystem package provides environmental protection, thermal management, testing and power distribution, the packaging controls the microsystems performance, cost, size, and reliability.
The stacked wafer technology provides a heterogeneously integrated, ultra-miniaturized, high performing, robust and cost-effective microsystem package. This highly integrated microsystem package can be miniaturized both in volume and footprint and provides all of the needed system level functions.
Sandia seeks to transfer technology for the benefit of the US industry. It is anticipated that commercial licenses may grant rights on a competitive basis to qualified interested parties for appropriate consideration. Licensing options may include grants for defined fields of use, non-exclusive rights, exclusive, or sublicensing rights.
Sandia National Laboratories is a multiprogram laboratory managed and operated by Sandia Corporation, a wholly owned subsidiary of Lockheed Martin Corporation, for the U.S. Department of Energy's National Nuclear Security Administration under Contract DE-AC04-94AL85000.
For further information, contact David Wick at Sandia National Laboratories by email, [email protected], phone (505) 844-2517, or fax (505) 844-8604.
Keywords: microsystem, microelectronics, microscale, packaging, heterogeneous, wafer, integrated, thermal management, power distribution, miniature, robust, stacked, chip, protection, dielectric